Logo Logo

business LASER

Laser department has the expertise and development process for semiconductors, displays, and secondary cell industry to providing various laser application fields.

Laser Application Equipment

Application to various fields such as display and semiconductor industry using laser

display Microfabrication equipment
  • The GaN LLO (Laser Lift-off) method grown on the Sapphire Wafer during the semiconductor device process is applied
  • Selective Ablation that ablates only the upper layer without damaging the lower part of the multi-layer structure
  • A-ITO uses its own POM (Pattern of Mirror) to reduce the number of processes with the technology of forming Etching and Pattern after anneal
  • Line, Square Beam shape adjustable
READ MORE
display SHEET/R2R micro patterning equipment
  • Step & Repeat and Continuous Movement Pattering Facility Using Roll to Roll Drive Laser
  • ITO Film / Glass Laser Patterning, Solar Cell Layer Patterning
READ MORE
display LCD/OLED Side pattern Equipment
  • Print AgPaste on LCD Panel Side and Laser Hardening, Patterning Equipment
  • Print AgPaste on Electrode Layer Between TFT, CF Layers
  • Minimize bezel with lateral patterning
  • ≥ 40" LCD Panel Target Facility
  • Full inspection of all areas is possible through inspection facilities
READ MORE
display LCD/OLED Side pattern Equipment
  • Cutting the ACF film on the micro LED using a DPSS laser and scanner or flying optics
  • The UV wavelength laser provides better cutting burr than CO2 lasers
READ MORE
display LASER ABLATION /ISOLATION EQUIPMENT
  • Equipment that removes surface substances by focusing lasers in µm units on the sample surface
  • Fine/precision processing with high precision Galvanometer Scanner
  • Can be laser modified to suit your needs, such as TCO Isolation or Metal Oxide Ablation
  • Easy to change pattern/model by applying CAD data
READ MORE
display TSP AG/TCO PATTERNING EQUIPMENT
  • Use of Fiber Laser and High Precision Optics
  • Fine pattern machining over a large area
  • Calibration of shrinkage/expansion of the film through a 4 point alignment
  • Concurrent processing of TCO/Ag patterns
  • Easy to change pattern/model by applying CAD data
READ MORE
display WAFER DICING EQUIPMENT
  • Full Cut & Stealth Dicing
  • Wafer Thickness : 50 ~ 400㎛
  • Max Dicing Speed : 150mm/s
  • Number of passes : 2~5
READ MORE
display WAFER MARKER EQUIPMENT
  • Wafer Top/Back Side Marker
  • Die Marking, Wafer ID Making
  • Wafer Metal Evaporation Layer Pattern Ablation
READ MORE
  • Microfabrication equipment
    Microfabrication equipment

    microfabrication equipment

    • LAser Department
    • Laser application equipment
    • DISPLAY
    PATTERNING Result

    • A-ITO Anneal Patterning

    • GaN Laser Lift-Off

    ITO, AgNW POM Patterning

    • The GaN LLO (Laser Lift-off) method grown on the Sapphire Wafer during the semiconductor device process is applied
    • Selective Ablation that ablates only the upper layer without damaging the lower part of the multi-layer structure
    • A-ITO uses its own POM (Pattern of Mirror) to reduce the number of processes with the technology of forming Etching and Pattern after anneal
    • Line, Square Beam shape adjustable
  • SHEET/R2R MICRO PATTERNING EQUIPMENT
    SHEET/R2R micro patterning equipment

    SHEET/R2R micro patterning equipment

    • Laser Department
    • Laser application equipment
    • DISPLAY
    ITO Film, Glass fine Patterning
    • Step & Repeat and Continuous Movement Pattering Facility Using Roll to Roll Drive Laser
    • ITO Film / Glass Laser Patterning, Solar Cell Layer Patterning
  • LCD/OLED SIDE PATTERN EQUIPMENT
    LCD/OLED Side pattern Equipment

    LCD/OLED Side Pattern Equipment

    • Laser Department
    • Laser application equipment
    • DISPLAY
    PANEL SIDE PATTERNING SAMPLE

    SIDE PATTERNING Result IMAGE

    Pattern Line / Space

    • Print AgPaste on LCD Panel Side and Laser Hardening, Patterning Equipment
    • Print AgPaste on Electrode Layer Between TFT, CF Layers
    • Minimize bezel with lateral patterning
    • ≥ 40" LCD Panel Target Facility
    • Full inspection of all areas is possible through inspection facilities
  • LASER FILM CUTTING EQUIPMENT
    LCD/OLED Side pattern Equipment

    LCD/OLED Side Pattern Equipment

    • Laser Department
    • Laser application equipment
    • DISPLAY
    UV-CO2 LASER CUTTING BURR COMPARE

    • UV

    • CO2

    • Cutting the ACF film on the micro LED using a DPSS laser and scanner or flying optics
    • The UV wavelength laser provides better cutting burr than CO2 lasers
  • LASER ABLATION /ISOLATION EQUIPMENT
    Laser Ablation / Isolation Equipment

    Laser Ablation / Isolation Equipment

    • Laser Department
    • Laser application equipment
    • DISPLAY
    TCO / Metal Oxide
    • Equipment that removes surface substances by focusing lasers in µm units on the sample surface
    • Fine/precision processing with high precision Galvanometer Scanner
    • Can be laser modified to suit your needs, such as TCO Isolation or Metal Oxide Ablation
    • Easy to change pattern/model by applying CAD data
  • TSP AG/TCO PATTERNING EQUIPMENT
    TSP Ag / TCO Patterning Equipment

    TSP Ag / TCO Patterning Equipment

    • LAser Department
    • Laser application equipment
    • DISPLAY
    PATTERNING TEST IMAGE

    • Ag Nanowire

    • ITO

    • 4point Align

    • Trace(AgPaste)

    • Trace(고배율)

    • Ag Nanowire

    • Use of Fiber Laser and High Precision Optics
    • Fine pattern machining over a large area
    • Calibration of shrinkage/expansion of the film through a 4 point alignment
    • Concurrent processing of TCO/Ag patterns
    • Easy to change pattern/model by applying CAD data
  • WAFER DICING EQUIPMENT
    • Full Cut & Stealth Dicing
    • Wafer Thickness : 50 ~ 400㎛
    • Max Dicing Speed : 150mm/s
    • Number of passes : 2~5
  • WAFER MARKER EQUIPMENT
    • Wafer Top/Back Side Marker
    • Die Marking, Wafer ID Making
    • Wafer Metal Evaporation Layer Pattern Ablation